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| CAS No.: | 870-72-4 | Other Names: | PN |
|---|---|---|---|
| MF: | HOCH2SO3Na | EINECS No.: | 212-800-9 |
| Type: | Syntheses Material Intermediates | Purity: | 28% |
| Application: | Leveling Agent, Brightener | Appearance: | Colorless And Transparent Liquid |
| Molecular Formula: | HOCH2SO3Na | Molecular Weight: | 134.09 |
| Density@20℃: | 1.20-1.25 | Refractive Index @20℃: | 1.3700-1.3830 |
| PH Value: | 7 | Assay: | 28% |
| HS Code: | 2942000000 | Product Name: | Hydroxymethanesulfonic Acid Monosodium Salt With Best Price |
| Port: | Shanghai | ||
| Highlight: | PN Brightener For Nickel Plating,Hydroxymethanesulfonic Acid Monosodium Salt,PN Hydroxymethanesulfonic Acid |
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Brightener for nickel plating PN Hydroxymethanesulfonic Acid Monosodium Salt CAS 870-72-4 with 28% colorless liquid
PN/Hydroxymethanesulfonic acid monosodium salt/ CAS 870-72-4
|
Chemical name |
Hydroxymethanesulfonic acid monosodium salt |
|
Trade name |
PN |
|
CAS No |
870-72-4 |
|
EINECS No |
212-800-9 |
|
Molecular formula |
HOCH2SO3Na |
|
Molecular weight |
134.09 |
|
Density@20℃ |
1.20-1.25 |
|
Refractive index @20℃ |
1.3700-1.3830 |
|
PH value |
7 |
|
Assay |
28% |
|
Appearance |
colorless and transparent liquid |
|
Application |
Leveling agent, brightener |
|
Usage |
10~100mg/L |
|
WGK Germany |
1 |
|
Risk Statements |
R363738 |
|
Safety Statements |
S2425 |
|
HS Code |
2942000000 |
| Nickel Plating Chemicals | ||
| Lasting Brightener and leveling agent | BOZ, BEO, BMP... | |
| Fast Brightener and Leveling agent | PA, PAP, PME.. | |
| Brighter and Strong/Lasting leveling agent | DEP, PABS, TC-DEP.. | |
| Stronger Leveling agent | PPS, PPS-OH.. | |
| Auxiliary & Assistant Brightener | ALS, VS, EHS, BBI.. | |
| Impurity Tolerance | ATPN , SSO3, PN | |
| Brighter and leveling agent at low area light | POPDH, PS, POPS,.. | |
| Low foam wetting agent | TC-EHS | |
| Semi-Bright | HD-M, TCA, .. | |
| Zinc Plating Chemicals | ||
| Acid Zinc Plating | BAR, OCBA, | |
| Alkaline Zinc Plating | WT/PUB. BPC-48, DPE,IMZE ,H1 | |
| Copper Plating Chemicals | ||
| Acid Copper Plating | SPS, M, H1, P-6000, UPS, DPS, ZPS, MPS | |
| Electroless Cu Plating | EDTP (Q75) | |
| Fine Chemicals: | ||
Contact Person: Emily Chan
Tel: 86-0-13006369714