97% Min SPS Bis Sodium Sulfopropyl Disulfide For Copper Foil CAS 27206-35-5
SPS Bis Sodium Sulfopropyl Disulfide
,97% Min Bis Sodium Sulfopropyl Disulfide
,97% Min CAS 27206-35-5
SPS Bis- sodium sulfopropyl disulfide for Copper Foil CAS 27206-35-5 at 97%min Purity
New Energy Chemicals copper foil additives SPS(Bis-(sodium sulfopropyl) disulfide)(CAS:27206-35-5)
SPS(Bis-(sodium sulfopropyl) disulfide)
CAS:27206-35-5
Trade name SPS(SP)
Chemical name Bis-(sodium sulfopropyl) disulfide
Molecular formula C6H12O6S4(Na)2
Assay 90%
Appearance White or yellowish powder
Application As a brightening agent for acid copper baths for decorative and functional deposits, it is functionally compatible with most components of typical copper bath formulation such as non-ionic surfactants, polymeric amines and other mercapto compounds.
1KGs/5KGS/20KGS
Our product list:
| Nickel Plating Chemicals | ||
| Lasting Brightener and leveling agent | BOZ, BEO, BMP... | |
| Fast Brightener and Leveling agent | PA, PAP, PME.. | |
| Brighter and Strong/Lasting leveling agent | DEP, PABS, TC-DEP.. | |
| Stronger Leveling agent | PPS, PPS-OH.. | |
| Auxiliary & Assistant Brightener | ALS, VS, EHS, BBI.. | |
| Impurity Tolerance | ATPN , SSO3, PN | |
| Brighter and leveling agent at low area light | POPDH, PS, POPS,.. | |
| Low foam wetting agent | TC-EHS | |
| Semi-Bright | HD-M, TCA, .. | |
| Zinc Plating Chemicals | ||
| Acid Zinc Plating | BAR, OCBA, | |
| Alkaline Zinc Plating | WT/PUB. BPC-48, DPE,IMZE ,H1 | |
| Copper Plating Chemicals | ||
| Acid Copper Plating | SPS, M, H1, P-6000, UPS, DPS, ZPS, MPS | |
| Electroless Cu Plating | EDTP (Q75) | |
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible