Transparent Liquid Cu Plating EDTP N N N' N'-Tetrakis 2-Hydroxypropyl Ethylenediamine
Transparent Liquid Cu Plating EDTP
,Transparent Cu Plating EDTP Liquid
Transparent Liquid 75%& 98% EDTP N N N' N'-Tetrakis 2-hydroxypropyl ethylenediamine cas: 102-60-3
Wetting agent EDTP N,N,N',N'-Tetrakis(2-hydroxypropyl)ethylenediamine
CAS:102-60-3
EINECS: 203-041-4
Trade name EDTP
Chemical name N,N,N’N’-tetra(2-hydropropyl)ethylene diamine
Molecular formula C14H32N2O4
Molecular Weight: 292.41
MDL Number: MFCD00004534
Mp: 32°c
Bp: 175-181°c at 0.8mmHg
Density: 1.03 g/ml (20°c)
refractive index : n20/D 1.4812(lit.)
Water Solubility: miscible
Assay: 98%
Appearance Colorless and transparent liquid
PH value 7.5-8.5
Application It is soluble in water easily, and the aqueous solution showes alkaline,Which is primarily used as complexing agent for chemical Cu plating.
Raw materials: Ethylenediamine
HS Code: 29221980
|
Chemical name |
Hexamethylene tramine tra hydroxy propy chloride; N,N,N’N’-tetrakis (2-Hydroxypropyl) ethylenedianmine;Q75 |
|
Molecular formula |
C14H32N2O4 |
|
Molecular weight |
294.4297 |
|
CAS No. |
102-60-3 |
Properties of PCB plating chemicals Q75
|
Physical form |
Colorless to light yellow clear liquid |
|
Concentration (%) |
74.5-75.5 |
|
PH |
8.0-12.0 |
|
Solubility(20°C) |
Miscible with water in all proportions |
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