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CAS No.: | 5398-29-8 | Other Names: | ATPN |
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MF: | C4H8ClN2O2S | Type: | Syntheses Material Intermediates, Electroplating Intermediates |
Purity: | 98% Min | Application: | Impurities Tolerance Agent |
Appearance: | White Powder | Port: | Shanghai |
Highlight: | ATPN Nickel Plating Brightener,S-Carboxyethylisothiuronium Betaine Nickel Plating Brightener,98% Purity Nickel Plating Brightener |
Nickel plating chemical intermediate ATPN CAS 5398-29-8
CAS:5398-29-8
Impurities tolerance agent in Nickel plating
ISO, REACH certificated
Product information:
Product name | 3-Isothioureidopropionic acid (Impurity tolerance agent ATPN) |
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Synonyms | 3-Isothioureidopropionic acid; S-Carboxyethylisothiuronium betaine; Carboxyethylisothiuronium Betaine; 3-(Amidinothio)propionic acid; 3-carbamimidoylsulfanylpropanoic acid; 3-(aminoiminomethyl)thio-propanoic acid; ATPN |
CAS Registry Number | 5398-29-8 |
Molecular Formula | C4H8N2O2S |
Molecular Weight | 148.18 |
Molecular Structure |
Characteristic:
Item | Description |
Appearance | White crystalline powder |
Assay | 98% |
Concentration in the bath | 1-10mg/L |
Consumption(g/KAH) | 1.5 |
Storage condition | Stored in cool and dry place |
* Quality is strictly controlled under ISO system, with excellent chemical stability.
Main application:
Chemical intermediate;
Impurities tolerance agent for Nickel plating, it can improve covering power at low current region.
Package: 5kg carton or 25kg fibre drum
Our product list:
Nickel Plating Chemicals | ||
Lasting Brightener and leveling agent | BOZ, BEO, BMP... | |
Fast Brightener and Leveling agent | PA, PAP, PME.. | |
Brighter and Strong/Lasting leveling agent | DEP, PABS, TC-DEP.. | |
Stronger Leveling agent | PPS, PPS-OH.. | |
Auxiliary & Assistant Brightener | ALS, VS, EHS, BBI.. | |
Impurity Tolerance | ATPN , SSO3, PN | |
Brighter and leveling agent at low area light | POPDH, PS, POPS,.. | |
Low foam wetting agent | TC-EHS | |
Semi-Bright | HD-M, TCA, .. | |
Zinc Plating Chemicals | ||
Acid Zinc Plating | BAR, OCBA, | |
Alkaline Zinc Plating | WT/PUB. BPC-48, DPE,IMZE ,H1 | |
Copper Plating Chemicals | ||
Acid Copper Plating | SPS, M, H1, P-6000, UPS, DPS, ZPS, MPS | |
Electroless Cu Plating | EDTP (Q75) | |
Fine Chemicals: | ||
3-Chloro-2-hydroxypropanesulfonic acid, sodium salt (CAS No.126-83-0), 1,3-Propane Sultone, 1,4-Butane sultone, Propargyl Chloride, Phenazine, M-Nitrobenzene Sulfonate, |
Contact Person: Emily Chan
Tel: 86-0-13006369714