The acidic copper plating additive M (2-thiobenzimidazole) can be plated with good flatness and toughness in the temperature range of 10 to 40 ℃.

M is a good brightener and leveling agent, and can also expand the bright range of the coating, especially the brightness effect of the low current density region. When M is used in combination with N (ethylenethiourea), the effect of N (ethylenethiourea) can also be maximized.

The mass concentration range of M is from 0.3 to 1.0 mg/L.

If the M mass concentration is too low, the brightness and leveling performance are both reduced, and the low current density area is not bright; if the M mass concentration is too high, the surface of the copper plating is fine linen sandy, even in orange peel and burnt, and the thickness of the copper plating in the low current density area is reduced.

M acts as a barrier to the electrodeposition of copper.

98% Powder Cas 583-39-1 Acid Copper Brightener M(2-Mercaptobenzimidazole)

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